发明名称 |
METHOD OF FORMING MICROCRYSTALLINE SEMICONDUCTOR FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming a microcrystalline semiconductor film with high crystallinity and a method of manufacturing with a high-productivity semiconductor device with favorable electrical characteristics.SOLUTION: After a first microcrystalline semiconductor film is formed on a substrate, the surface of the first microcrystalline semiconductor film is flattened, and then, an amorphous semiconductor region on the surface side of the flattened first microcrystalline semiconductor film is removed and a second microcrystalline semiconductor film with high crystallinity and having flatness is formed. Next, a third microcrystalline semiconductor film is formed on the second microcrystalline semiconductor film. |
申请公布号 |
JP2011205077(A) |
申请公布日期 |
2011.10.13 |
申请号 |
JP20110040297 |
申请日期 |
2011.02.25 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
TANAKA TETSUHIRO;YOKOI TOMOKAZU;ORIKI KOJI |
分类号 |
H01L21/205;H01L21/336;H01L29/786;H01L51/50;H05B33/10;H05B33/14 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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