SPUTTERING APPARATUS AND SPUTTERING METHOD

摘要

The sputtering apparatus has: a vacuum chamber in which a substrate is disposed; a cathode unit which is disposed inside the vacuum chamber so as to lie opposite to the substrate. The cathode unit has mounted a bottomed cylindrical target material 4 from a bottom side thereof into at least one recessed portion formed in one surface of a holder, and has assembled therein a magnetic field generator for generating a magnetic field in an inside space of the target material. The sputtering apparatus further has: an anode shield to which a positive electric potential is applied; a gas introduction device for introducing a sputtering gas into the vacuum chamber; a power supply for activating power to the cathode unit; a vertical magnetic field generator including coils disposed along a wall surface of the vacuum chamber about a reference axis connecting the cathode unit and the substrate, and a power supply; and a controller for switching on or off the introduction of the sputtering gas from the gas introduction device.