发明名称 GRINDING METHOD AND DEVICE
摘要 PROBLEM TO BE SOLVED: To provide grinding method and device which efficiently cleans by easily and surely removing deposits adhered to an electrode for electrolytic dressing.SOLUTION: In this grinding device 1, a workpiece W is ground by a metal bond grinding tool 3, the metal bond grinding tool 3 and the electrode 5 for electrolytic dressing are impressed to be a positive electrode and a negative electrode, respectively, and machining time for performing electrolytic dressing for the metal bond grinding tool 3 and non-machining time are repeated. During the non-machining time, polarities of the metal bond grinding tool 3 and the electrode 5 are reversed and cleaning of the electrode 5 is performed. Continuously, the non-machining time is transferred to the machining time after completing the cleaning based on a comparison result of a current measured value and a current threshold between the electrode 5 and the metal bond grinding tool 3. When the current measured value is the current threshold or below, the cleaning of the electrode 5 is repeated till the current measured value becomes larger than the current threshold.
申请公布号 JP2011200956(A) 申请公布日期 2011.10.13
申请号 JP20100069294 申请日期 2010.03.25
申请人 FUJI HEAVY IND LTD 发明人 SHIRAISHI SHINICHI
分类号 B24B53/00 主分类号 B24B53/00
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