发明名称 PRESS FIT TERMINAL AND SEMICONDUCTOR DEVICE
摘要 Disclosed are a press fit terminal and a semiconductor device capable of being easily and precisely worked, and of minimizing contact resistance upon a through hole without increasing press fit force at time of press fitting. A press fit terminal (10) is configured of a plurality of individual press fit terminal units (10L) stacked in layers. Contact weld parts (15) of the individual press fit terminal units (10L) are formed such that portions (15a) that diverge from leading end parts (14) are in opposition across a prescribed interval (15s). The plate thickness (tL) of the individual press fit terminal units (10L) is thinner than either the width (Ws) of the prescribed interval (15s) or the width (Wa) of the portions (15a) that diverge from the leading end parts (14). It is thus possible to easily and precisely work the press fit terminal (10), and, because the diverging parts (15a) of each respective individual press fit terminal unit (10) individually make pressure weld force act on the inner wall of a through hole (31), press fitting using a small amount of pressure weld force is also possible.
申请公布号 WO2011125747(A1) 申请公布日期 2011.10.13
申请号 WO2011JP58025 申请日期 2011.03.30
申请人 MITSUBISHI ELECTRIC CORPORATION;EGUSA MINORU;SUDO SHINGO;HAYASHI KENICHI 发明人 EGUSA MINORU;SUDO SHINGO;HAYASHI KENICHI
分类号 H01R12/51;H01R12/55 主分类号 H01R12/51
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