发明名称 MAGNETRON SPUTTERING APPARATUS AND SPUTTERING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a magnetron sputtering apparatus in which a magnetic field shape and a magnetic field strength on a target surface side can be easily changed and which allows the manufacturing cost thereof to be reduced as a result.SOLUTION: In the magnetron sputtering apparatus in which a magnet unit 10 is disposed on a rear surface side of a cathode to which a target 3 is attached, the magnet unit 10 is formed from an inner side magnet 11, an outer side magnet 12, a non-magnetic body fixing these and a yoke 14 connecting magnetic poles of the inner side magnet and the outer side magnet, and the yoke can be divided into a plurality of pieces by a surface orthogonal to a long side direction of the outer side magnet arranged in a rectangular shape.
申请公布号 JP2011202217(A) 申请公布日期 2011.10.13
申请号 JP20100069394 申请日期 2010.03.25
申请人 CANON ANELVA CORP 发明人 SASAKI MASAO
分类号 C23C14/35 主分类号 C23C14/35
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