| 摘要 |
<p>Disclosed is a method of inspecting an object to be inspected in a semiconductor manufacturing process, for resolving the problem that increasing sensitivity of a defect detector device so as to detect fine defects as patterns become more finely detailed may lead to detecting manufacturing variances and other matters that are not actual defects, complicating efforts to ascertain trends in the occurrence of defects. An image capture means is used to image capture a designated site of the object to be inspected; a defect is detected in the captured image; a circuit pattern is recognized from the captured image; a characteristic value is computed, relating to an image tone and shape, from the detected defect; a characteristic value is computed, relating to the image tone and shape, from the recognized circuit pattern; either a specified defect or circuit pattern is filtered and extracted from the detected defect and the recognized circuit pattern; a mapping characteristic value is determined from the characteristic value of either the filtered and extracted specified defect or circuit pattern; and the distribution of the determined characteristic values is displayed onscreen in a map format.</p> |
