| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem wherein printing by a thermal head cannot be performed to a non-contact IC card produced by a conventional production method for the non-contact IC card because thickness unevenness by flowage unevenness of an adhesive occurs around an incorporated member for the IC card.SOLUTION: This non-contact IC card is sequentially laminated with a front cover sheet and a core sheet for the front, a substrate mounted with at least an IC chip and an antenna, and a core sheet for the rear and a rear cover sheet through the adhesive. The IC chip is mounted on the substrate such that any of diagonal directions of the IC chip becomes nearly parallel to a long side or a short side of the non-contact IC card. |
