| 摘要 |
PROBLEM TO BE SOLVED: To improve connection strength and reliability of continuity in connection of a substrate and an electronic component.SOLUTION: In an anisotropic conductive connection material, a conductive particle 5 is dispersed in an adhesive 4, the adhesive 4 contains a film-forming material, an acrylic resin, an organic peroxide and an amine compound, and the amine compound is a cyclic tertiary amine compound. The cyclic tertiary amine compound is preferably an imidazole compound, and the imidazole compound preferably has a cyano group. Furthermore, the content of the cyclic tertiary amine compound is preferably 0.1-5 pts.mass based on 30 pts.mass of the acrylic resin. |
