CU-NI-SI-CO COPPER ALLOY FOR ELECTRONIC MATERIAL AND PROCESS FOR PRODUCING SAME

摘要

Provided is a Cu-Ni-Si-Co alloy which has an improved spring bending elastic limit. The alloy is a copper alloy for electronic materials which contains 1.0-2.5 mass% Ni, 0.5-2.5 mass% Co, and 0.3-1.2 mass% Si, with the remainder comprising Cu and incidental impurities. When the copper alloy is examined for pole figure by X-ray diffractometry using a rolled surface of the copper alloy as a base, ß-scanning at a=35º gives results in which the proportion of the diffraction peak height at ß=90º of the Cu {111} plane to that of the Cu {200} plane is at least 2.5 times the proportion thereof for a standard copper powder.