| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin varnish that has little dissolved oxygen content therein and few defects in appearance when molding, and a carrier material with a resin, a prepreg, and a laminated board using the resin varnish.SOLUTION: The resin varnish is used for forming an insulating layer. The resin varnish is composed of a resin composition including a thermosetting resin, a filler, and a solvent, and has the dissolved oxygen content of 50% or less. |
