| 摘要 |
PROBLEM TO BE SOLVED: To solve the problems that a surface is oxidized easily since the crystal grain size of a metal particle becomes small, and productivity cannot be increased since a film-forming speed is low when forming a plating film for an external terminal electrode by performing, for example copper nonelectrolytic plating onto an end face of a component body with each internal electrode edge exposed.SOLUTION: A first plating film 10, namely a substrate of the external terminal electrodes 8, 9, has a laminated structure comprising, for example, a first layer 13 made of copper and a second layer 14 on the first layer 13. A total thickness of the plating film 10 is set to 3 to 15 μm, and a thickness of the second layer 14 is set to 2 to 10 times larger than that of the first layer 13. The first layer 13 is formed by nonelectrolytic plating, and the second layer 14 is formed by electrolytic plating. Thus, the grain size of the metal particle included in the second layer 14 is set to at least 0.5 μm, and hence oxidation cannot occur easily. |
