| 摘要 |
<p>Provided are a light emitting device (100), a method for fabricating the light emitting device, and a light emitting device package. The light emitting device includes a light emitting structure including a first conductive type semiconductor layer (130), an active layer (140) under the first conductive type semiconductor layer, and a second conductive type semiconductor layer (150) under the active layer, a conductive support member (170), and a protection member (125) on the light emitting structure. The light emitting structure has a first width (D1) and a second width (D2). A difference between the first width and the second width defines a stepped structure or an inclined structure. The protection member is disposed on the stepped or the inclined structure defined by the difference between the first and second widths of the light emitting structure.</p> |
