发明名称 |
Bonding structure and fabrication thereof |
摘要 |
A bonding structure and the method of fabricating the same are disclosed. The bonding structure of the invention includes a copper-based pad formed in an insulator layer and a protection layer substantially covering top surface of the copper-based pad. The protection layer is self-aligned formed and the material thereof is selected from a group consisting of metal nitride, copper alloy, copper compounds, and a combination thereof.
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申请公布号 |
US8034711(B2) |
申请公布日期 |
2011.10.11 |
申请号 |
US20070964195 |
申请日期 |
2007.12.26 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
YU CHEN-HUA;TSENG HORNG-HUEI |
分类号 |
H01L21/4763;H01L23/48 |
主分类号 |
H01L21/4763 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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