Wiring substrate with plurality of wiring and insulating layers with a solder resist layer covering a wiring layer on the outside of outer insulating layer but exposing the holes in the outer insulating layer

摘要

In a wiring substrate in which plural wiring layers and insulating layers are alternately stacked and the adjacent wiring layers are electrically connected through a via hole formed in the insulating layer, plural holes constructing substrate management information recognizable as a character, a symbol, etc. are formed in the outside insulating layer of the insulating layers.