| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic package suppressed in reduction of detection accuracy of a sensor chip with thermal stress.SOLUTION: The ceramic package formed by laminating a plurality of ceramic sheets is equipped with: a ceramic part formed by a ceramic layer of the laminated ceramic sheets; and a wiring part disposed in and on a surface of the ceramic part. The ceramic part has: a fixed part having one surface in a ceramic sheet laminating direction, serving as a sensor chip mounting region; and a surrounding part integrated with the fixed part and surrounding the periphery of the fixed part, and the wiring part is disposed on the surrounding part. |
