发明名称 METHOD OF MANUFACTURING GLASS SUBSTRATE, METHOD OF MANUFACTURING PACKAGE, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS AND RADIO CONTROLLED TIMEPIECE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a glass substrate that is superior in conductivity while reducing manufacturing costs and improving manufacturing efficiency, along with a method of manufacturing a package, the package, a piezoelectric vibrator, an oscillator, an electronic apparatus, and a radio controlled timepiece.SOLUTION: A method of manufacturing a glass substrate includes: a wire spreading step of spreading a wire 72 that becomes a through-electrode along an axial direction inside a container 73; a filling step of filling the container 73 with fused glass 71: a hardening step of hardening the fused glass 71 to form a glass body with which the wire 72 is integrated; and a cutting step of cutting the glass body so as to be perpendicular to the axial direction.
申请公布号 JP2011199674(A) 申请公布日期 2011.10.06
申请号 JP20100065133 申请日期 2010.03.19
申请人 SEIKO INSTRUMENTS INC 发明人 TAKANO KENJI
分类号 H03H3/02;H01L23/15;H03B5/32;H03H9/02 主分类号 H03H3/02
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