发明名称 |
METHOD OF MANUFACTURING GLASS SUBSTRATE, METHOD OF MANUFACTURING PACKAGE, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS AND RADIO CONTROLLED TIMEPIECE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a glass substrate that is superior in conductivity while reducing manufacturing costs and improving manufacturing efficiency, along with a method of manufacturing a package, the package, a piezoelectric vibrator, an oscillator, an electronic apparatus, and a radio controlled timepiece.SOLUTION: A method of manufacturing a glass substrate includes: a wire spreading step of spreading a wire 72 that becomes a through-electrode along an axial direction inside a container 73; a filling step of filling the container 73 with fused glass 71: a hardening step of hardening the fused glass 71 to form a glass body with which the wire 72 is integrated; and a cutting step of cutting the glass body so as to be perpendicular to the axial direction. |
申请公布号 |
JP2011199674(A) |
申请公布日期 |
2011.10.06 |
申请号 |
JP20100065133 |
申请日期 |
2010.03.19 |
申请人 |
SEIKO INSTRUMENTS INC |
发明人 |
TAKANO KENJI |
分类号 |
H03H3/02;H01L23/15;H03B5/32;H03H9/02 |
主分类号 |
H03H3/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|