发明名称 PHOTOCURABLE RESIN COMPOSITION
摘要 <p>The disclosed photocurable resin composition exhibits a good black color while also being highly sensitive. A dry film resulting therefrom feels very dry to the touch. The disclosed photocurable resin composition exhibits minimal outgassing, e.g. during curing. When used, for example, to form a solder resist for a printed circuit board, said photocurable resin composition provides excellent alignment precision, high productivity, and high reliability. The disclosed photocurable resin composition is characterized by containing: a photopolymerization initiator, each molecule of which has two oxime ester groups; a colorant; a carboxyl-containing resin; and a compound, each molecule of which has a plurality of ethylene unsaturated groups.</p>
申请公布号 WO2011122025(A1) 申请公布日期 2011.10.06
申请号 WO2011JP01921 申请日期 2011.03.30
申请人 TAIYO HOLDINGS CO., LTD.;SHIBASAKI, YOKO;ARIMA, MASAO 发明人 SHIBASAKI, YOKO;ARIMA, MASAO
分类号 G03F7/031;G03F7/004;H05K3/28 主分类号 G03F7/031
代理机构 代理人
主权项
地址