| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state imaging device allowing a pad to be formed on a surface of a board on the side opposite to a wiring layer side without producing a large step, and improved in imaging characteristics and a yield, and also to provide a method of manufacturing the same.SOLUTION: This solid-state imaging device having a wiring layer 60 on a first surface side of a board 30 for entering light from a second surface side of the board 30 has: an interlayer insulation film 40 formed on the first surface side of the board 30 for covering a photoelectric conversion element and an active element; a wiring layer 60 formed on the interlayer insulation film 40; a support board 80 arranged above the wiring layer 60; a first contact C1 formed by penetrating the interlayer insulation film 40 and the board 30 and connected to the wiring layer 60; and an opening CH3 of an insulation film 90 formed on the second surface side of the board 30 and reaching the first contact C1. |
