| 摘要 |
PROBLEM TO BE SOLVED: To prevent a dielectric material from being damaged by stress related to embedding a die into a substrate or other mechanical force.SOLUTION: The substrate having (i) a first laminate layer 116, (ii) a second laminate layer 120, and (iii) a core material 118 that is disposed between the first laminate layer 116 and the second laminate layer 120; and a die 102 attached to the first laminate layer 116, the die 102 having an interposer 108 bonded to a surface of an active side of the die, the surface including (i) the dielectric material and (ii) a bond pad 106 to route electrical signals of the die 102, the interposer 108 having a via 110 formed therein, the via 110 being electrically coupled to the bond pad 106 to further route the electrical signals of the die. |
