发明名称 VAPOR DEPOSITION APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus capable of obtaining the sufficient vapor deposition rate by suppressing any degradation of the properties of a vapor deposition material.SOLUTION: The vapor deposition apparatus 1 includes an evaporation vessel 3 for evaporating a vapor deposition material filled therein, a vapor deposition vessel 2 which is arranged above the evaporation vessel 3 to guide the evaporated vapor deposition material via a communication part 4, and execute the vapor deposition of the material on a glass substrate K, and a vapor flow rate regulating valve 5 which is arranged on the communication part 4 to regulate the passing amount of the evaporated vapor deposition material. A demarcating member 6 for demarcating an evaporation vessel body into an upper space part 31U and a lower space part 31L leaving a part of a communication space 31M is arranged in an upper part inside the evaporation vessel body 30. A lower heating unit 65L capable of heating the vapor deposition material in the lower space part 31L is arranged on a lower surface side of the demarcating member 6, and a cooling unit 62 for cooling the vapor deposition material moved from the lower space part 31L into the upper space part 31U via the communication space 31M and an upper heating unit 65U for heating and evaporating the vapor deposition material deposited on an upper surface of the demarcating member 6 are arranged on an upper surface side of the demarcating member 6.
申请公布号 JP2011195916(A) 申请公布日期 2011.10.06
申请号 JP20100065369 申请日期 2010.03.23
申请人 HITACHI ZOSEN CORP 发明人 MATSUMOTO YUJI;FUJIMOTO EIJI
分类号 C23C14/24;C23C14/12;H05B33/10 主分类号 C23C14/24
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