| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive tape for circuit protection on polishing a semiconductor wafer having, as an adhesive layer, an adhesive which has tack to surely fix a wafer before irradiation with energy rays and, after the irradiation, has good energy ray irradiation efficiency and a high curability of the tacky component as such, sufficiently decreases the tack to excels in peelability, and is paste residue-free.SOLUTION: The adhesive tape 10 is used in processing semiconductors in which adhesion is lowered owing to irradiation with energy rays and has an energy ray curable adhesive layer 12 on at least one side of a base film 14 and the adhesive layer comprises a (meth)acrylate copolymer as an adhesive component, a photopolymerization initiator, and 0.5-10.0 vol.% inorganic filler based on the entire volume of the adhesive layer. |
