Continuous hot dip galvanizing of electrolytic cells and for processing finished solar cell, comprises partially adjoining electrical contact factor of an electrical conductor for feeding electroplating current at a surface of cells

摘要

The method for continuous hot dip galvanizing of electrolytic cells and for further processing of finished a solar cell (1), comprises partially adjoining an electrical contact factor of an electrical conductor (6) for feeding an electroplating current at a surface of the cells to be galvanized so that the conductor is permanently, mechanically and electrically connected throughout the galvanization of the material. The conductor or the support extends above the length of the substrate and carries the substrate to the electrolytic cell during the galvanization. The method for continuous hot dip galvanizing of electrolytic cells and for further processing of finished a solar cell (1), comprises partially adjoining an electrical contact factor of an electrical conductor (6) for feeding an electroplating current at a surface of the cells to be galvanized so that the conductor is permanently, mechanically and electrically connected throughout the galvanization of the material. The conductor or the support extends above the length of the substrate and carries the substrate to the electrolytic cell during the galvanization and positioning of the cell such that the bottom of the substrate is galvanized using electrolytes (12). The conductor is pressed or attracted by a counter-layer to one side of the cells using a weight force, a dynamic pressure of a fluid or an elastic force at the other side of the cells or by liquid suction at a seed layer of the cells. The magnetic conductor at the one side of the cells corresponds to magnets placed at the other side of the seed layer of the cells. The electroplating current is fed into conductor at a projection (8) outside of the electrolytes.