| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip resistor which is mounted to a component built-in type printed substrate, has no possibility of damaging a resistor and a protective film when forming a via hole with laser, and does not request extremely high positional accuracy upon laser irradiation.SOLUTION: A lower surface side electrode 31a which is a portion of one lower surface side and a lower surface side electrode 31b which is a portion of the other lower surface side in a pair of electrodes 30 have substantially the same sizes, and have nearly the same shapes (or nearly the point-symmetrical shapes). The proportion of the total of a first area and a second area to the total area of the first area which is an area of the lower surface side electrode 31a, the second area which is an area of the lower surface side electrode 31b, and a third area which is the area of a region between the lower surface side electrode 31a and the lower surface side electrode 31b is 75-90%. An interval between the lower surface side electrode 31a and the lower surface side electrode 31b is 60 μm or larger. |
