| 发明名称 |
METHOD FOR MANUFACTURE OF INLINE INTEGRATED CIRCUIT SYSTEM |
| 摘要 |
A method for manufacture of an integrated circuit package system includes: providing a leadframe with an integrated circuit mounted thereover; encapsulating the integrated circuit with an encapsulation; mounting an etch barrier below the leadframe; and etching the leadframe.
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| 申请公布号 |
US2011244635(A1) |
申请公布日期 |
2011.10.06 |
| 申请号 |
US201113159095 |
申请日期 |
2011.06.13 |
| 申请人 |
|
发明人 |
YEE JAE HAK;MYUNG JUNWOO;JANG BYOUNG WOOK;KIM YOUNGCHUL |
| 分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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