| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that reduces the possibility that a semiconductor element gets out of order.SOLUTION: The semiconductor device includes: the semiconductor element 10; a first electrode member 21 laminated on the semiconductor element 10; a second electrode member 22 laminated on the opposite side of the first electrode member 21 across the semiconductor element 10; first solder 31 for joining the semiconductor element 10 and first electrode member 21 together; and second solder 32 for joining the semiconductor element 10 and second electrode member 22 together. The second electrode member 22 has a plurality of insulating columns 22a to 22d extending in the laminating direction of the semiconductor element 10 and electrode members 21 and 22. Further, the plurality of insulating columns 22a to 22d are positioned in a region B different from an arrangement region A of the semiconductor element 10, and arranged at irregular intervals (a) and (b) in a rotating direction of the semiconductor element 10 in a region C which comes into contact with the semiconductor element 10 when the semiconductor element 10 rotates. |
