发明名称 METHOD AND STRUCTURE FOR CONNECTION BETWEEN ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To secure electric connection reliability by securely and electrically connecting electronic components to each other.SOLUTION: ACFs 30 are arranged on an electrode 12 of an FPC 10, they are temporarily pressed, and a thermoplastic adhesive 40 is applied onto or arranged on the ACF 30. Then, the FPC 20 and the FPC 10 are positioned such that an electrode 22 faces the electrode 12, and applied with pressure without being heated so as to temporarily press both with a thermosetting resin 31 of the ACF 30 and to temporarily fix them with the thermoplastic adhesive 40. Conductive particles 32 of the ACF 30 are sandwiched between the electrodes 12 and 22 by applying pressure by a crimping tool while heating them so as to make electric connection, and further the thermosetting resin 31 is cured to complete the connection. The thermoplastic adhesive 40 is cured while partially mixed with the thermosetting resin 31. The temporary pressing and temporary fixation are carried out before primary pressing, so the connection is securely made while preventing a lateral shift etc.
申请公布号 JP2011199138(A) 申请公布日期 2011.10.06
申请号 JP20100066267 申请日期 2010.03.23
申请人 FUJIKURA LTD 发明人 SATO NAOHISA
分类号 H01L25/065;H01L21/60;H01L25/07;H01L25/18 主分类号 H01L25/065
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