发明名称 PATTERN FORMING METHOD, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND RESIST FILM
摘要 PROBLEM TO BE SOLVED: To provide a pattern forming method with the excellent exposure latitude (EL) and focus margin (DOF) capable of reducing the line width irregularity (LWR) and residual defect, a chemically amplified resist composition and a resist film.SOLUTION: The pattern forming method includes: (α) a step of forming a film with a substantially alkaline-insoluble resin (A) with a polarity increased by action of an acid for reducing the solubility to a developing solution including an organic solvent, a nonionic compound (B) for generating an acid by radiation of an active ray or a radioactive, and a chemically amplified resist composition (C) including a solvent; (β) a step of exposing the film; and (γ) a step of developing the film with a developing solution including an organic solvent. Also, a chemically amplified resist composition used for the pattern forming method, and a resist film formed with the chemically amplified resist composition are provided.
申请公布号 JP2011197587(A) 申请公布日期 2011.10.06
申请号 JP20100067075 申请日期 2010.03.23
申请人 FUJIFILM CORP 发明人 KATO KEITA;TARUYA SHINJI;KAMIMURA SATOSHI;ENOMOTO YUICHIRO;IWATO KAORU
分类号 G03F7/004;G03F7/038;G03F7/32;H01L21/027 主分类号 G03F7/004
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