发明名称 METHOD OF MANUFACTURING SUBSTRATE
摘要 The present invention relates to a method for manufacturing a substrate that provides a uniform roughness to the rear face of the substrate using sand blasting. The method for manufacturing a substrate according to the present invention comprises: a slicing step for slicing an ingot in a wafer-shape; a sand blasting step for sand blasting at least one of the two faces of the substrate that has been sliced in a wafer-shape; a lapping step for lapping the two faces of the substrate, the lapping step being carried out between the slicing step and the sand blasting step; a heat treating step for heat treating the sand-blasted substrate; and a polishing step for mirror polishing the front face of the heat-treated substrate.
申请公布号 KR20110107480(A) 申请公布日期 2011.10.04
申请号 KR20100026600 申请日期 2010.03.25
申请人 CRYSTAL-ON CO., LTD. 发明人 KANG, JIN KI;MA, JAE YOUNG;PARK, HONG JIN;LEE, KYOUNG HO
分类号 H01L21/786;H01L21/301 主分类号 H01L21/786
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