发明名称 |
METHOD OF MANUFACTURING SUBSTRATE |
摘要 |
The present invention relates to a method for manufacturing a substrate that provides a uniform roughness to the rear face of the substrate using sand blasting. The method for manufacturing a substrate according to the present invention comprises: a slicing step for slicing an ingot in a wafer-shape; a sand blasting step for sand blasting at least one of the two faces of the substrate that has been sliced in a wafer-shape; a lapping step for lapping the two faces of the substrate, the lapping step being carried out between the slicing step and the sand blasting step; a heat treating step for heat treating the sand-blasted substrate; and a polishing step for mirror polishing the front face of the heat-treated substrate. |
申请公布号 |
KR20110107480(A) |
申请公布日期 |
2011.10.04 |
申请号 |
KR20100026600 |
申请日期 |
2010.03.25 |
申请人 |
CRYSTAL-ON CO., LTD. |
发明人 |
KANG, JIN KI;MA, JAE YOUNG;PARK, HONG JIN;LEE, KYOUNG HO |
分类号 |
H01L21/786;H01L21/301 |
主分类号 |
H01L21/786 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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