发明名称 |
Multi-chip package for LED chip and multi-chip package LED device including the multi-chip package |
摘要 |
Provided is a multi-chip package light emitting diode (LED) device including a plurality of LED chips within a single package. The LED device may include a base substrate, a multi-chip package for a LED on the base substrate, and a light radiator surrounding the multi-chip package and radiating light emitted by the multi-chip package for a LED, wherein the multi-chip package for a LED may include a plurality of LED chips on a single wafer substrate.
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申请公布号 |
US8030670(B2) |
申请公布日期 |
2011.10.04 |
申请号 |
US20080314738 |
申请日期 |
2008.12.16 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM KYOUNGKOOK;PARK YOUNGSOO |
分类号 |
H01L33/00;H01L33/62 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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