| 摘要 |
<p>PURPOSE: A semiconductor package is provided to deposit semiconductor dies of the same structure by forming an enable side electrode and a dummy side electrode at an incline on the semiconductor dies. CONSTITUTION: A substrate has a wiring pattern for selecting a plurality of dies and a wiring pattern for a signal. A first semiconductor die(120) is electrically connected to the substrate. The first semiconductor die has penetration electrodes(123, 124) for selecting a die and a penetration electrode for the signal. A second semiconductor die(130) is electrically connected to the first semiconductor die and has the same structure as the first die.</p> |
