| 摘要 |
A capacitive touch pad includes an electrode board, a plurality of capacitive touch sensor pads, and a cover. The electrode board has touch sensor circuitry formed thereon. The plurality of capacitive touch sensor pads is formed in an array over the touch pad circuitry of the printed circuit board. The plurality of capacitive touch sensor pads is spaced apart by a predetermined distance to form spaces between the pads of the plurality of capacitive touch sensor pads. The cover is positioned over and covering substantially all of the plurality of capacitive touch sensor pads. The cover has a first cavity with a first depth, where the first cavity is shaped to form an air gap between the pads of the plurality of capacitive touch sensor pads to dampen capacitive coupling between adjacent touch pads.
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