| 摘要 |
PROBLEM TO BE SOLVED: To prevent a connection defect of a semiconductor package using semiconductor package tapes. SOLUTION: In the method of manufacturing the semiconductor device includes the steps of: winding a first semiconductor package tape around a first reel; winding a first spacer tape outside the first reel and first semiconductor package tape; mounting a semiconductor chip on a second semiconductor package tape extracted from a second reel; and winding a reel with the first spacer tape extracted from the first reel over the second semiconductor package tape having the semiconductor chip mounted. In the method of manufacturing the semiconductor device, the first reel is prevented from producing foreign matters of a conductor in a period from when the first semiconductor package tape is wound to when the first semiconductor package tape is extracted, thereby reducing connection defects of a semiconductor package fabricated from the first semiconductor package tape. COPYRIGHT: (C)2011,JPO&INPIT |
