MANUFACTURING METHOD FOR ELECTRONIC DEVICE, AND SPUTTERING METHOD

摘要

The disclosed manufacturing method for an electronic device is provided with: a first step, in which a substrate holder is brought in proximity to a first shield member so that a first ring-shaped protruding section formed on the first shield member and a second ring-shaped protruding section formed on a second shield member, which is disposed on the surface of the substrate holder around the outer periphery of a substrate, are positioned so as to be fitted to each other without making contact; a second step, after the first step, in which a target is sputtered while maintaining the first protruding section and the second protruding section in the position in which both are fitted to each other without making contact; and a third step, after the second step, in which a film is formed on the substrate by sputtering the target after opening the first shield member.