| 摘要 |
PROBLEM TO BE SOLVED: To provide a susceptor for heat treatment and a heat treatment apparatus that prevent a substrate from cracking during irradiation with flash light from a flash lamp. SOLUTION: The susceptor 72, which holds a semiconductor wafer W during flash heating through irradiation with the flash light from the flash lamp, has a recess 78 formed in a truncated conic shape whose opening widens upward. An upper bottom surface (an opening surface of the recess 78) of the truncated conic shape is larger than a plane size of the semiconductor wafer W, and a lower bottom surface (a bottom surface 78a of the recess 78) is smaller than the plane size of the semiconductor wafer. When the semiconductor wafer W is held by the susceptor 72 having the recess 78 formed, a peripheral end of the wafer W is supported by a tapered surface 78b of the recess 78. Consequently, a clearance including an air layer is formed between a lower surface of the semiconductor wafer W and an upper surface of the susceptor 72. COPYRIGHT: (C)2011,JPO&INPIT |
