| 摘要 |
PROBLEM TO BE SOLVED: To provide a placing table structure that efficiently and inexpensively recover a raw material itself and metal contained in the raw material by suppressing the number of times of a dry cleaning process or eliminating the dry cleaning process itself. SOLUTION: The placing table structure 22 is configured to place a subject W to be processed thereon, the subject W being used for forming a thin film on the surface of the subject W using a raw material gas composed of the raw material of an organic metal compound in a processing container which can be evacuated, and the placing table structure 22 includes: a placing table body 114 on which the subject to be processed is placed and inside which heaters 26 are prepared; and a base 116 which supports the placing table body in a state where the base surrounds the side surfaces and the bottom surface of the placing table body, and which has, inside of the base, a cooling medium path 28 wherein a cooling medium flows, and which is kept in a temperature range between a temperature below the decomposition temperature and a temperature equal to or higher than the solidification temperature or the liquefaction temperature of the raw material gas. Consequently, elimination of the dry cleaning process itself and so on are achieved to efficiently recover the raw material itself and the metal contained in the raw material. COPYRIGHT: (C)2011,JPO&INPIT |
