发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
According to an embodiment, a separation layer and a wiring layer having an organic insulating film formed of a resin material and a metal wiring are sequentially formed on a support substrate. Regions of the organic insulating film corresponding to dicing regions are removed. Plural semiconductor chips are mounted on the wiring layer. A sealing resin layer is formed on the separation layer. The sealing resin layer is formed to cover edge surfaces of the device forming regions. The support substrate is separated from a resin sealing body having the wiring layer, the plural semiconductor chips and the sealing resin layer. The resin sealing body is cut according to the dicing regions to cingulate a structure configuring a semiconductor device.
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申请公布号 |
US2011233786(A1) |
申请公布日期 |
2011.09.29 |
申请号 |
US201113044958 |
申请日期 |
2011.03.10 |
申请人 |
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发明人 |
HOMMA SOICHI;MIURA MASAYUKI;KAMOTO TAKU;HONGO SATOSHI |
分类号 |
H01L23/28;H01L21/50;H01L21/56 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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