发明名称 SUBSTRATE DRYING METHOD, CONTROL PROGRAM, AND SUBSTRATE DRIER
摘要 PROBLEM TO BE SOLVED: To provide a substrate drying method, a control program, and a substrate drier for suppressing the occurrence of a defect. SOLUTION: A substrate drier 1 is provided with a rinse liquid nozzle 20, a dried air nozzle 30, a moving mechanism 40 for moving the rinse liquid nozzle 20 and the dried air nozzle 30, a rotating mechanism 10 for rotating the substrate W, and a control device 50 in which a control program is installed. A substrate drying method executed by the control program of the control device 50 includes a process for drying a central area as a range where the center of rotation Wc of the substrate W exists in a range where a dried air flow Gf collides with the substrate W, and a process for drying the outside of the central area. In the central area drying process, an IPA contained in the dried air flow Gf is still smaller than 2 mol%, and in the outside area drying process, the IPA has a higher concentration than that in the central area drying process. Thus, it is possible to suppress the occurrence of the defect in the central area whose centrifugal force is small. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011192967(A) 申请公布日期 2011.09.29
申请号 JP20110009074 申请日期 2011.01.19
申请人 EBARA CORP 发明人 ISHIBASHI TOMOATSU;FUKAYA KOICHI;NAKAMURA AKIRA
分类号 H01L21/304 主分类号 H01L21/304
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