发明名称 |
MULTI MATERIAL SECONDARY METALLIZATION SCHEME IN MEMS FABRICATION |
摘要 |
Processes are provided herein for the fabrication of MEMS utilizing both a primary metal that is integrated into the final MEMS structure and two or more sacrificial secondary metals that provide structural support for the primary metal component during machining. A first secondary metal is thinly plated around the primarj metal and over the entire surface of the substrate without using photolithography. A second secondary metal, is then thickly plated over the deposited first secondary metal without using photolithography. Additionally, techniques are disclosed to increase the deposition rate of the first secondary metal between primary metal features in order to prevent voiding and thus enhance structural support of the primary metal during machining. |
申请公布号 |
WO2011059827(A3) |
申请公布日期 |
2011.09.29 |
申请号 |
WO2010US54766 |
申请日期 |
2010.10.29 |
申请人 |
TOUCHDOWN TECHNOLOGIES, INC.;LEAVY, MONTRAY |
发明人 |
LEAVY, MONTRAY |
分类号 |
H01L21/768 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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