| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method and a device capable of performing with high accuracy in a noncontact manner, propriety determination of a fine diameter wire bonding, such as, a semiconductor device or an LED device which cannot be determined by conventional image inspection methods, or the like. <P>SOLUTION: The device is constituted of a heating laser 1 for heating in manner of spots a bonding part of a fine diameter wire; a dual-wavelength infrared radiometer 2 for measuring the temperature at a high speed, by correcting the emissivity from a small quantity of infrared rays irradiated from a part to be heated of the fine diameter wire; and a correction operation determination means 4 for determining the quality of bonding performed by comparing the numerical value correlated with a temperature change, after correction or a bonding area acquired from the temperature change, with the numerical value correlated with the temperature change shown by a non-defective article used as a reference which is corrected to a temperature change in a reference heating power or a bonding area acquired from the temperature change, after correcting a measurement result by the dual-wavelength infrared radiometer 2 into the temperature change in the reference heating power. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
