| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin paste for die bonding that is easily supplied and applied by a printing method to even a substrate which needs to be stuck at relatively low temperature, and to provide a use of a semiconductor device etc., using the same. <P>SOLUTION: The resin paste for die bonding includes a carboxylic acid-terminated butadiene homopolymer or copolymer (A), a thermosetting resin (B), a filler (C), and a printing solvent (D), wherein the elastic modulus of the resin paste after dry curing is in a range of 1 to 100 MPa (25°C). The solid content is preferably from 40 to 90 wt.%, the thixotropy index is preferably from 1.5 to 8.0, and the viscosity (25°C) is preferably from 5 to 1,000 Pa s. Using this resin paste, a semiconductor device is produced by a method including (1) applying a predetermined quantity of the resin paste to a substrate, (2) drying the resin paste to bring the resin to B-stage, (3) mounting a semiconductor chip on the B-stage resin, and (4) post-curing of the resin. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
