| 摘要 |
According to one embodiment, a semiconductor memory device including an organic substrate with an external connection terminal and a semiconductor memory chip. The semiconductor memory device further includes a lead frame having a bonded portion and an installation portion. It further includes a resin mold for sealing the semiconductor memory chip. The lead frame is provided with a plurality of extensions at least from one of the installation portion and the bonded portion, in a way of extending at least to two or more sides of the resin mold.
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