| 摘要 |
The invention provides a processing method for an optical device wafer, which can cut the optical device without reducing the quality. The processing method is to cut the optical device wafer into multiple optical devices along a separating channel. The processing method comprises a laser processing groove forming process where laser ray having absorbing wavelength with respect to a substrate of the optical device wafer is irradiated along the separating channel, and the laser processing groove, the origin of a fracture is formed on the surface or the rear face of the substrate; a deteriorated substance removing process, where a cutting tool with diamond abrasive particles as the main component is positioned at the laser processing groove of the substrate and the cutting tool is rotated and scans the wall face of the laser processing groove and conducts a relative movement, and thereby deteriorated substance generated during the formation of the laser processing groove is removed and the wall face of the laser processing groove is processed into a rough processing face; a wafer cutting process, where pressure is applied on the optical device wafer which breakes along the processing groove deprived of deteriorated substance, and multiple optical devices are generated. |
