| 摘要 |
PURPOSE: A method for inspecting the shape of solder bumps in a flip-chip device using an X-ray inspection is provided to confirm the junction of the solder bumps using intensity distribution obtained from the X-ray inspection. CONSTITUTION: The red-green-blue(RGB) color images of a flip-chip device which is boned on a substrate are obtained through an X-ray inspection(S110). Light and shade images are obtained from the RGB color images(S121, S122). Intensity distribution displaying the distribution of the intensity of light is obtained from the light and shade images(S130). The shape of the solder bumps in the flip-chip device is verified through the intensity distribution(S141 to S143). |
