| 摘要 |
In a method for processing or treating a plurality of printed circuit boards, comprising the following steps: providing a plurality of printed circuit boards (4, 5, 6, 7), providing at least one frame or carrier element (2, 3), for coupling to a plurality of printed circuit boards (4, 5, 6, 7), coupling or connecting the printed circuit boards (4, 5, 6, 7) to the at least one frame or carrier element (2, 3), processing or treating the printed circuit boards (4, 5, 6, 7) in the state coupled to the frame or carrier element (2, 3), it is provided that printed circuit boards (4, 5, 6, 7) of different sizes and/or thicknesses and/or of different constructions are coupled to the at least one frame or carrier element (2, 3) to form a composite assembly (1) and are subjected to further processing in the composite assembly (1) formed by the printed circuit boards (4, 5, 6, 7) and the at least one frame or carrier element (2, 3). Furthermore, a composite assembly (1) for processing or treating a plurality of printed circuit boards (4, 5, 6, 7) and also a use of such a method and composite assembly (1) are provided. |
