| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device package manufacturing method by which a base substrate of insulating material and a cover substrate of insulating material can be bonded together via a metal film by anodic bonding in a stable manner. <P>SOLUTION: The electronic device package manufacturing method includes the steps of: forming a metal film on both surfaces of a cover substrate 3 so that the metal film on one surface and a metal surface on the other surface may conduct with each other; aligning and superimposing the cover substrate 3 and a base substrate 2; and bonding the base substrate 2 and the cover substrate 3 together by anodic bonding by bringing an electrode plate 21 to be connected to a negative electrode into contact with the base substrate 2 on a surface opposite to a surface bonded to the cover substrate 3, bringing an electrode plate 22 to be connected a positive electrode into contact with the cover substrate 3 on a surface opposite to a surface bonded to the base substrate 2, and applying a voltage between the electrode plate 22 to be connected to a positive electrode and the electrode plate 21 to be connected to a negative electrode. <P>COPYRIGHT: (C)2011,JPO&INPIT |
