| 摘要 |
PROBLEM TO BE SOLVED: To solve such problems that failure of spreading of resin is caused by slightly deviating a coating needle position, and that failure where the coating needle interferes the IC is caused, in a device for resin-coating the periphery of an IC including underfill coating of a side-fill method. SOLUTION: A block 21 wherein control size is added to XY size of the IC is mounted on a needle position confirming stage 20, and a block of XY size of the IC is mounted on the block. Further, a needle contact control unit 23 for detecting contact between the needle and the needle position confirming stage is provided. A positional relation (dimension X, dimension Y) between the to-be-coated IC and the needle position confirming block is previously input, and the needle is needle-trail-operated at the position confirming stage, to indirectly confirm the positional relation to the IC. Thereby failure of spreading of the resin due to deviation of the needle position and failure where the needle interferes the IC are suppressed. COPYRIGHT: (C)2011,JPO&INPIT
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