发明名称 SOLID-STATE IMAGING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To obtain a high SN ratio even when pixels are made to be fine. <P>SOLUTION: A solid-state imaging device includes: a plurality of pixels 201, which are provided on a semiconductor substrate of a first conductivity type, and each of which has a semiconductor region 201a of a second conductivity type in which light incident from a first surface side of the semiconductor substrate is converted into signal charges to be stored; a readout circuit provided on a second surface side opposite to the first surface of the semiconductor substrate and configured to read out signal charges stored in pixels; fine metal structures 250 provided periodically on a surface of the semiconductor region on a side on which the light is incident; and an insulating film 236a provided between the fine metal structures and semiconductor region. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011187857(A) 申请公布日期 2011.09.22
申请号 JP20100054032 申请日期 2010.03.11
申请人 TOSHIBA CORP 发明人 IIDA YOSHINORI;TSUTSUMI EISHI;FUJIMOTO AKIRA;ASAKAWA KOUJI;MOMOSE HISAYO;KOKUBU KOICHI;MOMO NOBUYUKI
分类号 H01L27/146;H01L31/10 主分类号 H01L27/146
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