发明名称 RESIST PATTERN FORMATION DEVICE, RESIST PATTERN FORMATION METHOD, AND WAFER LENS PRODUCTION METHOD
摘要 <p>Disclosed is a resist pattern formation device that is capable of suppressing the removal or partial loss of a necessary resist pattern. The resist pattern formation device (70) is equipped with a rotatable stage (72) upon which a substrate is disposed, a developing solution discharging unit (78) that discharges a developing solution onto the aforementioned substrate disposed on the stage (72), and a gas venting unit (80) that vents gas onto the aforementioned substrate disposed on the stage (72), and is characterized in that, when the aforementioned substrate is disposed on the stage (72) and the developing solution is discharged from the developing solution discharging unit (78) toward the outer edge of the aforementioned substrate, gas is vented from the gas venting unit (80), and the gas flows towards the outer edge from the interior of the aforementioned substrate.</p>
申请公布号 WO2011114883(A1) 申请公布日期 2011.09.22
申请号 WO2011JP54728 申请日期 2011.03.02
申请人 KONICA MINOLTA OPTO, INC.;HAYASHIDA TAKAICHI;KISHINAMI KATSUYA;AOKI KENTARO 发明人 HAYASHIDA TAKAICHI;KISHINAMI KATSUYA;AOKI KENTARO
分类号 G03F7/30;H01L21/027 主分类号 G03F7/30
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