| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet for grinding a wafer back face weakened in peeling force in peeling after adhesion, and restrained in manufacturing cost without leaving an adhesive when peeled. SOLUTION: This adhesive sheet for grinding a wafer back face is used for protecting a wafer front face formed with an uneven circuit pattern in grinding the wafer back face. In the adhesive sheet for grinding a wafer back face, an intermediate layer contacting a base material film is one having a glass transition point Tg equal to or below 20°C, and having plasticity or elasticity at ordinary temperature, an adhesive layer and the intermediate layer are ones formed by applying coating liquids for forming them at the same time, and, when the adhesive layer side is stuck to an SUS-304BA plate, peeling force in JIS Z 0237 before ionization radiation irradiation is 1.0-8.0 N/10 mm, and peeling force in JIS Z 0237 after ionization radiation irradiation is lower than 1.0 N/10 mm. COPYRIGHT: (C)2011,JPO&INPIT |
