| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device of which small size, thinness and cost reduction is facilitated and which has superior heat dissipation, and to provide a method of manufacturing the same. <P>SOLUTION: The light-emitting device includes an electrode substrate, a light-emitting element 16, and a translucent insulator 19. The electrode substrate has a first lower conductor layer 13 comprising different metal layers, a first electrode conductor 11 formed on the first lower conductor layer, a second lower conductor layer 14 formed apart from the first lower conductor layer and comprising different metal layers, a second electrode conductor 12 formed on the second lower conductor layer and spaced apart from the first electrode conductor, and an insulator layer 15 charged between the first and second electrode conductors on the lower conductor layer, wherein the first and second electrode conductors have side faces exposed from the insulator layer, and the electrode substrate is cut away by a region where the first and second electrode conductors come in contact with the insulator layer. The light-emitting element 16 is arranged on the electrode substrate, and electrically connected to upper surface portions of the first and second electrode conductors or bottom portions of the first and second lower conductor layers. The translucent insulator 19 seals the light-emitting element on the electrode substrate, and transmits light from the light-emitting element. <P>COPYRIGHT: (C)2011,JPO&INPIT |
